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S75PL-N MirrorBitTM ORNANDTM MCPs
Stacked Multi-Chip Product (MCP) S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write, Page-mode Flash Memory (NOR Interface) S30ML-P: ORNAND Flash (NAND Interface) 3V pSRAM
Data Sheet (Advance Information)
S75PL-N MirrorBitTM ORNANDTM MCPs Cover Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information, Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S75PL-N_00
Revision 01E
Issue Date April 21, 2006
Data
Sheet
(Advance
Information)
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion LLC therefore places the following conditions upon Advance Information content:
"This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice."
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content:
"This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications."
Combination
Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion LLC applies the following conditions to documents in this category:
"This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion LLC deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur."
Questions regarding these document designations may be directed to your local AMD or Fujitsu sales office.
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S75PL-N MirrorBitTM ORNANDTM MCPs
April 21, 2006 S75PL-N_00-01E
S75PL-N MirrorBitTM ORNANDTM MCPs
Stacked Multi-Chip Product (MCP) S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write, Page-mode Flash Memory (NOR Interface) S30ML-P: ORNAND Flash (NAND interface) 3V pSRAM
Data Sheet (Advance Information)
Features
Speed
- PL-N: 70 ns (initial access, 30 ns page access) - ML-P: 30 ns (page access) - pSRAM: 70 ns
107-Ball Fine-Pitch Ball Grid Array (FBGA)
- 9 x 12 x 1.4mm for ML512P based MCP's - 11 x 13 x 1.4mm for ML01GP based MCPs
Operating Temperature Range
- Temperature Range of -25C to +85C
General Description
This document contains information for the S75PL-N MirrorBit MCP product. TheS75PL-N product consists of the following devices:
S29PL-N S30ML-P 3 V pSRAM
Flash/RAM Combinations Table
pSRAM Density S29PL127N + S30ML512P S30ML01GP 32 Mb S75PL127NBF 64 Mb
Product Selector Guide
Device S75PL127NBF pSRAM Density 32 Mb pSRAM Type pSRAM Type 7
For detailed specifications, please refer to the individual data sheets:
Document S29PL-N S30ML-P 32M pSRAM Type 7 Publication Identification Number (PID) S29PL-N_M0 S30ML-GP_00 pSRAM_29
Publication Number S75PL-N_00
Revision 01E
Issue Date April 21, 2006
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
Data
Sheet
(Advance
Information)
1.
S75PL
Ordering Information
The ordering part number is formed by a valid combination of the following:
127 N B F JF W GZ 0 PACKING TYPE 0 = Tray 2 = 7" Tape and Reel 3 = 13" Tape and Reel
MODEL NUMBER Refer to the Valid Combinations table below
TEMPERATURE RANGE W = Wireless (-25C to +85C)
PACKAGE TYPE AND MATERIAL JA = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free Compliant package JF = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free package
ORNAND DATA DENSITY F = S30ML512P G = S30ML01GP
pSRAM DENSITY B = 32 Mb pSRAM C = 64 Mb pSRAM D = 128 Mb pSRAM PROCESS TECHNOLOGY N = 110 nm MirrorBitTM Technology
FLASH DENSITY 256 = 256 Mb 127 = 128 Mb (Single CE#)
DEVICE FAMILY S75PL = 3.0 Volt-only Simultaneous Read/Write, Page Mode Flash Memory with Data storage ORNAND and pSRAM
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S75PL-N MirrorBitTM ORNANDTM MCPs
S75PL-N_00_01E April 21, 2006
Data
Sheet
(Advance
Information)
1.1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations.
Valid Combinations Base Ordering Part Number (2) S75PL127NBF Package & Temperature JAW, JFW Model Number GZ Packing Type 0, 2, 3 (1), (2) pSRAM Type Type 7 PL-N Linear Mode Access Time 70 ns ML-P Page Mode Access Time 30 ns pSRAM Linear Mode Access Time 70 ns
Package Name FMH107 9x12x1.4mm, 107 ball
Notes: 1. 7\SH LV VWDQGDUG 6SHFLI\ RWKHU RSWLRQV DV UHTXLUHG 2. BGA package marking omits leading "S" and packing type designator from ordering part number. 3. Contact factory for availability for any of the OPNs listed since RAM type availability may vary over time.
2. Block Diagram (S29PL-N and pSRAM on Bus 1, S30ML-P on Bus 2)
A0-A20 A21-A22 A0-A20 A21-A22
RY/BY#
RY/BY#
DQ0-DQ15
DQ0-DQ15
S29PL127N
F-CE# OE# F-RST# F-ACC/WP# WE# CE# OE# RESET# ACC/WP# WE# VSS VSS
VCC VCCQ
F-VCC
A0-A20
DQ0-DQ15
R-CE#
CE# OE# LB# UB# WE# R-CE2
R-LB# R-UB# R-CE2
32Mb pSRAM Memory
VSS VCC VCCQ
R-VCC
I/O0-I/O7
I/O0-I/O7
N-RY/BY#
RY/BY#
VCC
N-VCC
N-CLE N-CE# N-ALE N-RE# N-WP# N-WE# N-PRE
CLE CE# ALE RE# WP# WE# PRE
S30ML512P x8 ORNAND
FP# I/O0-I/O7 VSS I/O0-I/O7 N-VSS
S75PL-N_00_01E April 21, 2006
S75PL-N MirrorBitTM ORNANDTM MCPs
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Data
Sheet
(Advance
Information)
3. Connection Diagrams
3.1 S75PL-N Pinout
Figure 3.1 107-ball Fine-Pitch Ball Grid Array (S75PL127NBF)
1 A 2 3 4 5 6 7 8 9 10
B DNU C Index No ball DNU DNU DNU
RFU
VSS
RFU
RFU
RFU
RFU
RFU
RFU
RFU
D N-RY/BY E N-RE# F N-CE# G N-VCC H N-VSS J N-CLE K N-ALE R-CE1# L N-WE# N-WP# M DNU N DNU P DNU DNU DNU RFU RFU VSS RFU I/O0 I/O1 I/O2 I/O3 N-PRE DQ8 DQ2 DQ11 RFU DQ5 DQ14 I/O4 I/O5 DQ0 DQ10 F-VCC R-VCC DQ12 DQ7 VSS I/O6 pSRAM Only F-CE# OE# DQ9 DQ3 DQ4 DQ13 DQ15 RFU I/O7 ORNAND Flash Only A0 VSS DQ1 RFU RFU DQ6 RFU A16 VSSn A1 A4 A17 RFU RFU A10 A14 A22 VCCn A2 A5 A18 RY/BY# A20 A9 A13 A21 RFU DNU A3 A6 UB# RST# R-CE2 A19 A12 A15 RFU Reserved for Future Use RFU A7 LB# WP#/ ACC WE# A8 A11 RFU RFU Legend
NOR Flash Only
Note: Top view--balls facing down. The addresses that are shared vary by MCP combination as shown in the table below:
PL-N Addresses S75PL127NBF A22-A21
PL-N/pSRAM Addresses A20:A0
Special Handling Instructions for FBGA Package
Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150C for prolonged periods of time.
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S75PL-N MirrorBitTM ORNANDTM MCPs
S75PL-N_00_01E April 21, 2006
Data
Sheet
(Advance
Information)
3.2
FMH107--107-Ball Fine Pitch Ball Grid Array (FBGA) 9 x 12 mm package
Figure 3.2 FMH107
D
0.15 C (2X)
10 9 8 7 6 5 4
A
D1 eD
SE
7
E eE
E1
3 2 1
INDEX MARK PIN A1 CORNER 9
MLKJ
HG F
EDC
BA
B
7
PIN A1 CORNER
TOP VIEW
0.15 C (2X)
SD
BOTTOM VIEW A A2 A1
6
0.20 C
C
0.08 C
107X
b
SIDE VIEW
0.15 M C A B 0.08 M C
NOTES: PACKAGE JEDEC DxE SYMBOL A A1 A2 D E D1 E1 MD ME n Ob eE eD SD / SE 0.35 FMH 107 N/A 12.00 mm x 9.00 mm PACKAGE MIN --0.17 0.94 NOM ------12.00 BSC. 9.00 BSC. 8.80 BSC. 7.20 BSC. 12 10 107 0.40 0.80 BSC. 0.80 BSC. 0.40 BSC. A3,A4,A5,A6,A7,A8, B1,M3,M4,M5,M6,M7,M8 0.45 MAX 1.40 --1.11 PROFILE BALL HEIGHT BODY THICKNESS BODY SIZE BODY SIZE MATRIX FOOTPRINT MATRIX FOOTPRINT MATRIX SIZE D DIRECTION MATRIX SIZE E DIRECTION BALL COUNT BALL DIAMETER BALL PITCH BALL PITCH SOLDER BALL PLACEMENT DEPOPULATED SOLDER BALLS 9. 8. 6 7 NOTE 4. 5. 2. 3. 1. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. ALL DIMENSIONS ARE IN MILLIMETERS. BALL POSITION DESIGNATION PER JEP95, SECTION 4.3, SPP-010. e REPRESENTS THE SOLDER BALL GRID PITCH. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME. DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW SD OR SE = 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3512 \ 16-038.19 \ 8.9.05
S75PL-N_00_01E April 21, 2006
S75PL-N MirrorBitTM ORNANDTM MCPs
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Data
Sheet
(Advance
Information)
4.
4.1
Revision History
Revision A (April 21, 2006)
Initial release.
Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright (c) 2006 Spansion LLC. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, and combinations thereof are trademarks of Spansion LLC. Other names are for informational purposes only and may be trademarks of their respective owners.
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S75PL-N MirrorBitTM ORNANDTM MCPs
S75PL-N_00_01E April 21, 2006

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